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| SKiiP 3-phase bridge Absolute Maximum Ratings Symbol Visol Top ,Tstg IGBT and VCES 5) VCC IC 3) Tj IF IFM IFSM 2 I t (Diode) Driver VS1 VS2 fsmax dV/dt 4) Conditions 1) Values 4000 -25...+85 1700 1200 -40...+150 Units V C V V A C A A A 2 kAs V V kHz kV/s AC, 1min Operating / stor. temperature Diode Operating DC link voltage IGBT IGBT + Diode Diode Diode, tp < 1 ms Diode, T j = 150 C, 10ms; sin Diode, T j = 150 C, 10ms Stabilized Power Supply Non-stabilized Power Supply Switching frequency Primary to secondary side 1) SKiiPPACK(R) SK integrated intelligent Power PACK 3-phase bridge with brake chopper SKiiP 7,9) 192 GDL 170 - 475 CTV Preliminary Data Case S5GDL 10 18 30 20,0 75 Characteristics Symbol IGBT V(BR)CES ICES VTO rT VCesat VCesat Eon + Eoff CCHC LCE Conditions min. VCES - - - - - - - - - - - - - - - - - typ. - 1 10 1,77 23,6 5,1 3,85 127/195 0,8 15 2,60 - 18 0,90 8,1 - - - max. - - - - - - - - - - - 2,90 - - - 0,129 0,375 0,033 Units V mA mA V m V V mJ nF nH V V mJ V m C/W C/W C/W mA mA s A A C V Driver without supply VGE = 0, T j = 25 C VCE = VCES T j = 125 C T j = 125 C T j = 125 C IC = 140A, T j = 125 C IC = 140A, T j = 25 C VCC=900/1200V, IC=150A T j = 125 C per Phase, AC side Top, Bottom 2) Features * Short circuit protection, due to evaluation of current sensor signals * Isolated power supply * Low thermal impedance * Optimal thermal management with integrated heatsink * Pressure contact technology with increased power cycling capability, compact design * Low stray inductance * High power, small losses * Over-temperature protection 1) Inverse Diode VF = VEC IF= 140A; VF= VEC IF= 140A; Eon + Eoff IF= 150A; VTO T j = 125 C rT T j = 125 C T j = 125 C T j = 25 C T j = 125 C 2) 3) 4) Thermal Characteristics 10) Rthjs per IGBT 10) Rthjs per Diode 6,10) Rthsa P16 heatsink; see case Driver IS1 Supply current 15V-supply IS2 Supply current 24V-supply tinterlock-driver Interlock-time SKiiPPACK protection ITRIPSC Short circuit protection ITRIPLG Ground fault protection TTRIP Over-temp. protection 9) UDCTRIP UDC-protection Mechanical Data M1 DC terminals, SI Units M2 AC terminals, SI Units (c)by SEMIKRON 5) 6) 7) 340+380*fs/fsmax+3,5*IAC/A 250+260*fs/fsmax+2,6*IAC/A 2,3 188 2% 43 +/- 2% 115 5% 1225 2% 4 8 - - 15.07.99 6 10 9) 10) T heatsink = 25 C, unless otherwise specified CAL = Controlled Axial Lifetime Technology (soft and fast) without driver Driver Input to DC Link/ AC Output to heatsink with Semikron-DC link (low inductance) other heatsinks on request C - Integrated current sensors T - Temperature protection V - 15 V or 24 V power supply options available for driver: U - DC link voltage sense F - Fiber optic connector "s" referenced to temperature sensor Nm Nm SKiiP Brake-chopper Absolute Maximum Ratings Symbol Visol Top ,Tstg IGBT and VCES 5) VCC IC 3) Tj IF IFM IFSM 2 I t (Diode) Driver VS1 VS2 fsmax dV/dt 4) Conditions 1) Values 4000 -25...+85 1700 1200 -40...+150 Units V C V V A C A A A 2 kAs V V kHz kV/s AC, 1min Operating / stor. temperature Diode Operating DC link voltage IGBT IGBT + Diode Diode Diode, tp < 1 ms Diode, T j = 150 C, 10ms; sin Diode, T j = 150 C, 10ms Stabilized Power Supply Non-stabilized Power Supply Switching frequency Primary to secondary side 1) SKiiPPACK(R) SK integrated intelligent Power PACK 3-phase bridge with brake chopper SKiiP 7,9) 192 GDL 170 - 475 CTV Preliminary Data Case S5GDL 10 18 30 20,0 50 Characteristics Symbol IGBT V(BR)CES ICES VTO rT VCesat VCesat Eon + Eoff CCHC LCE Conditions min. VCES - - - - - - - - - - - - - - - - - typ. - 1 10 1,77 23,6 5,1 3,85 127/195 0,8 15 2,60 - 18 0,90 8,1 - - - max. - - - - - - - - - - - 2,90 - - - 0,129 0,375 0,033 Units V mA mA V m V V mJ nF nH V V mJ V m C/W C/W C/W mA mA s A A C V Nm Nm Driver without supply VGE = 0, T j = 25 C VCE = VCES T j = 125 C T j = 125 C T j = 125 C IC = 140A, T j = 125 C IC = 140A, T j = 25 C VCC=900/1200V, IC=150A T j = 125 C per Phase, AC side Top, Bottom 2) Features * Short circuit protection, due to evaluation of current sensor signals * Isolated power supply * Low thermal impedance * Optimal thermal management with integrated heatsink * Pressure contact technology with increased power cycling capability, compact design * Low stray inductance * High power, small losses * Over-temperature protection 1) Inverse Diode VF = VEC IF= 140A; VF= VEC IF= 140A; Eon + Eoff IF= 150A; VTO T j = 125 C rT T j = 125 C T j = 125 C T j = 25 C T j = 125 C 2) 3) 4) Thermal Characteristics 10) Rthjs per IGBT 10) Rthjs per Diode 6,10) Rthsa P16 heatsink; see case Driver IS1 Supply current 15V-supply IS2 Supply current 24V-supply tinterlock-driver Interlock-time SKiiPPACK protection ITRIPSC Short circuit protection ITRIPLG Ground fault protection TTRIP Over-temp. protection 9) UDCTRIP UDC-protection Mechanical Data M1 DC terminals, SI Units M2 AC terminals, SI Units 5) 6) 7) 67+10*fs/fsmax+0*IAC/A 67+10*fs/fsmax+0*IAC/A 2,3 VCEsat-protection 2% 115 5% 1225 2% 4 8 - - 15.07.99 6 10 9) 10) T heatsink = 25 C, unless otherwise specified CAL = Controlled Axial Lifetime Technology (soft and fast) without driver Driver Input to DC Link/ AC Output to heatsink with Semikron-DC link (low inductance) other heatsinks on request C - Integrated current sensors T - Temperature protection V - 15 V or 24 V power supply options available for driver: U - DC link voltage sense F - Fiber optic connector "s" referenced to temperature sensor (c)by SEMIKRON |
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